Investigation of the thermal resistance of miniature heat pipes

Authors

  • Владимир Юрьевич Кравец Национальный технический университет Украины «Киевский политехни-ческий институт», пр. Победы, 37, г. Киев, 03056, Ukraine
  • Ярослав Васильевич Некрашевич Национальный технический университет Украины «Киевский политехни-ческий институт», пр. Победы, 37, г. Киев, 03056, Ukraine
  • Анна Петровна Гончарова АК «КиевЭнерго», пл. И. Франка, 5, Киев 01001, Ukraine

DOI:

https://doi.org/10.15587/1729-4061.2011.2449

Keywords:

Мiniature heat pipe, thermal resistance, vapour space diameter, angle of inclination

Abstract

The paper presents the results of an experimental study of thermal resistance of miniature heat pipes with metal-fibrous capillary structure. It is shown that the size of thermal resistance is influenced by a considerable quantity of factors, оne of defining factors is a vapour space diameter

Author Biographies

Владимир Юрьевич Кравец, Национальный технический университет Украины «Киевский политехни-ческий институт», пр. Победы, 37, г. Киев, 03056

Кандидат технических наук

Доцент кафедры атомных электростанций и инженерной теплофизики

Ярослав Васильевич Некрашевич, Национальный технический университет Украины «Киевский политехни-ческий институт», пр. Победы, 37, г. Киев, 03056

Магистр

Инженер 3 категории кафедры атомных электростанций и инженерной теплофизики

Анна Петровна Гончарова, АК «КиевЭнерго», пл. И. Франка, 5, Киев 01001

Инженер

References

  1. Cotter, T. P. Principles and Prospects of Micro Heat Pipes [Текст]/ T.P. Cotter // 5th International Heat Pipe Conference, Tsukuba, Japan. – 1984. – P. 328-335.
  2. Ha, J. M. The Maximum Heat Transport Capacity of Micro Heat Pipes [Текст]/ J. M. Ha, G. P. Peterson // ASME J. Heat Transfer. – 1998. – Vol. 120, №4. – pp. 1064-1071.
  3. Schneider, M. Investigation of interconnected mini heat pipe arrays for micro electronics cooling [Текст]/ M.Schneider, M.Yoshida, M.Groll // 11th International Heat Pipe Conference, Sept. 14, 1999, Tokyo, Japan, Vol.1. – p. 7-9.
  4. Moon, S.H. Experimental study on the thermal performance of micro-heat pipe with cross-section of polygon [Текст]/ S.H.Moon, G.Hwang, S.C.Ko, Y.T.Kim// Microelectronics Reliability. – 2004. – Vol. 44. – pp. 315 – 321.
  5. Теплова мікротрубка [Текст]: пат. № 50435 А, Україна: / Кравець В.Ю., Ніколаєнко Ю.Є. – 2002.
  6. Hopkins R. Flat miniature heat pipes with micro capillary grooves/ R. Hopkins , A. Faghri , D. Khrustalev [Текст] // Journal of heat transfer –1999. –Vol. 121, №1, – pp. 102-109.
  7. Paiva K.V. Experimental study of a wire mini heat pipe for microgravity test [Текст]/ K.V.Paiva, M.B.H.Mantelli, A.J.A.Buschinelli // 13-th International Heat Pipe Conference, Sept. 21-25, 2004, Shanghai, China, –pp. 163 – 169.
  8. Babin B.R. Steady – State Modeling and Testing of a Micro Heat Pipe [Текст]/ B.R.Babin, G.P.Peterson, D.Wu // Journal of Heat Transfer –1990, –Vol. 112., –pp. 595 – 601.
  9. Vasiliev L.L. Miniature Heat Pipes For Electronic Equipment Thermal Control [Текст]/ L.L.Vasiliev, A.G.Kulakov, M.I.Rabetsky, A.A. Antukh // Proceeding of the V Minsk International Seminar “Heat pipes, Heat Pumps, Refrigerators”, September 4-7, 2002, Minsk, Belarus, –pp. 270-278.
  10. Семена М.Г. Тепловые трубы с металловолокнистыми капиллярными структурами [Текст]/ М.Г. Семена, А.Н. Гершуни, В.К. Зарипов –К.: Вища шк., Головное изд-во, 1984. – 215 с.

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How to Cite

Кравец, В. Ю., Некрашевич, Я. В., & Гончарова, А. П. (2012). Investigation of the thermal resistance of miniature heat pipes. Eastern-European Journal of Enterprise Technologies, 1(9(49), 55–60. https://doi.org/10.15587/1729-4061.2011.2449

Issue

Vol. 1 No. 9(49) (2011): Technology of organic and inorganic substances and ecology

Section

Ecology

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Copyright (c) 2014 Владимир Юрьевич Кравец, Ярослав Васильевич Некрашевич, Анна Петровна Гончарова

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