[1]
Kiselev, E., Krytska, T., Stroiteleva, N. and Turyshev, K. 2019. Thermal microelectromechanical sensor construction. Eastern-European Journal of Enterprise Technologies. 6, 9 (102) (Dec. 2019), 46–52. DOI:https://doi.org/10.15587/1729-4061.2019.184443.