[1]
Ткачук, Н.Н. and Ткачук, А.Н. 2010. To the question on contact interaction of the flat stamp with semispace. Eastern-European Journal of Enterprise Technologies. 3, 9(45) (May 2010), 50–53. DOI:https://doi.org/10.15587/1729-4061.2010.2895.