1.
Sknar I, Petrenko L, Cheremysinova A, Plyasovskaya K, Kozlov Y, Amirulloeva N. Investigation of adsorption behavior of smoothing additives in copper plating electrolytes. EEJET [Internet]. 2017Apr.26 [cited 2024Dec.21];2(11 (86):43-9. Available from: https://journals.uran.ua/eejet/article/view/95724