LIMITATIONS OF COPPER NITRATE ELECTROLYTE FOR FAST ELECTROCHEMICAL 3D-PRINTING
DOI:
https://doi.org/10.24025/2306-4412.4.2022.265832Keywords:
local electrodeposition, deposit profile, computer modeling, profilometry, dendritesAbstract
To date, technologies based on local sintering of metal powder have become widespread for forming a metal product by 3D-printing. The disadvantage of additive manufacturing technologies based on local melting is high energy consumption, as well as the need to obtain metal powder or wire before making a product from it. The electrochemical technology of additive manufacturing, which is based on the local electrochemical deposition of metal from an electrolyte, does not have such disadvantages. An investigation of local electrodeposition of metallic copper from a nitrate electrolyte was conducted in order to determine the possibility of using this electrolyte in electrochemical 3D printing technology. Deposition was carried out using a platinum insoluble anode placed in a polypropylene capillary with a diameter of 4 mm. Cylinder-shaped coatings with a height of 100 μm and 500 μm were grown at different current densities in stationary and pulsed modes. Experimentally deposited samples were analyzed using 3D-profilometry, the surface profile was compared with the computer model and the desired coating profile. It has been established that the highest printing accuracy is achieved at a deposition current density of 20 A/dm2 when a deposition thickness is below 100 μm. In these conditions, the highest deposition accuracy is observed - 87% of the coating is deposited within the expected borders, and only 9% - outside these borders. The deposited metal is densely packed and has a finely crystalline structure. An increase in the deposition thickness and the deposition current density and the use of a pulse mode led to a decrease in the accuracy of the deposition and the quality of the coating due to the appearance of diffusion limitations and the formation of dendrites. Thus, the nitrate electrolyte allows for high-quality local electrodeposition of copper of a small thickness (up to 100 μm) at a current density of up to 20 A/dm2. Further studies of electrochemical 3D printing processes should be directed to the search for an electrolyte and deposition conditions that allow metal local electrodeposition with an accuracy no worse than that obtained in this work, but for thicknesses of up to 1 mm and more.
References
C. Korner, "Additive manufacturing of metallic components by selective electron beam melting - a review", International Materials Reviews, vol. 61, no. 5, pp. 361-377, 2016.
P. Regenfuss et al., "Principles of laser micro sintering", Rapid Prototyping Journal, vol. 13, no. 4, pp. 204-212, 2007.
L. Xinchao, M. Pingmei, A. Sansan, and W. Wei, "Review of additive electrochemical micro-manufacturing technology", International Journal of Machine Tools and Manufacture, vol. 173, p. 103848, 2021.
Г. С. Васильєв, Д. Ю. Ущаповський, В. І. Воробйова, та О. В. Лінючева, "Моделювання процесів електрохімічного 3d-друку", Наукові вісті КПІ, № 2, с. 97-105, 2021.
G. Vasyliev, V. Vorobyova, D. Uschapovskiy, and O. Linyucheva, "Local electrochemical deposition of copper from sulfate solution", Journal of Electrochemical Science and Engineering, vol. 12, no. 3, pp. 557-563, 2022.
S. D. Leith, and D. T. Schwartz, "High-rate through-mold electrodeposition of thick (>200 μm) NiFe MEMS components with uniform composition", Journal of Microelectromechanical Systems, vol. 8, no. 4, pp. 384-392, 1999.
A. L. Cohen, U. Frodis, F. G. Tseng, G. Zhang, M. Florian, and P. M. Will, "EFAB: low-cost automated electrochemical batch fabrication of arbitrary 3D microstructures", in Proc. Micromachining and Microfabrication Process Technology V, vol. 3874, pp. 236-247, 1999.
J. D. Madden, S. R. Lafontaine, and I. W. Hunter, "Fabrication by electrodeposition: building 3D structures and polymer actuators", in Proc. IEEE Sixth International Symposium on Micro Machine and Human Science, 1995, pp. 77-81.
J. Xu, W. Ren, Z. Lian, P. Yu, and H. Yu, "A review: development of the maskless localized electrochemical deposition technology", The International Journal of Advanced Manufacturing Technology, vol. 110, pp. 1731-1757, 2020.
P. Hanekamp, W. Robl, and F. M. Matysik, "Development and application of a multipurpose electrodeposition cell configuration for studying plating processes on wafer specimen and for characterizing surface films by scanning electrochemical microscopy", Journal of Applied Electrochemistry, pp. 1-8, 2017.
S. Morsali, S. Daryadel, Z. Zhou, A. Behroozfar, D. Qian, and M. Minary-Jolandan, "Multi-physics simulation of metal printing at micro/nanoscale using meniscus-confined electrodeposition: Effect of environmental humidity", Journal of Applied Physics, vol. 121, pp. 024903-024908, 2017.
J. Hu, and M. F. Yu, "Meniscus-confined three-dimensional electrodeposition for direct writing of wire bonds", Science, vol. 329, no. 5989, pp. 313-316, 2010.
S. K. Seol et al., "Electrodeposition-based 3D printing of metallic microarchitectures with controlled internal structures", Small, vol. 11, no. 32, pp. 3896-3902, 2015.
A. Behroozfar, S. Daryadel, S. R. Morsali, S. Moreno, M. Baniasadi, R. A. Bernal, and M. Minary-Jolanda, "Microscale 3D printing of nanotwinned copper", Advanced Materials, vol. 30, no. 4, pp. 1705107-1705113, 2017.
P. Liu, Y. Guo, Y. Wu, J. Chen, and Y. Yang, "A low-cost electrochemical metal 3D printer based on a microfluidic system for printing mesoscale objects", Crystals, vol. 10, no. 4, pp. 257-273, 2020.
K. Nakazawa, M. Yoshioka, Y. Mizutani, T. Ushiki, and F. Iwata, "Local electroplating deposition for free-standing micropillars using a bias-modulated scanning ion conductance microscope", Microsystem Technologies, vol. 26, pp. 1-10, 2019.
G. Ercolano, C. V. Nisselroy, T. Merle, J. Voros, D. Momotenko, W. W. Koelmans, and T. Zambelli, "Additive manufacturing of sub-micron to sub-mm metal structures with hollow AFM cantilevers", Micromachines, vol. 11, pp. 6-20, 2020.
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Copyright (c) 2022 Георгій Васильєв, Дмитро Ущаповський, Вікторія Воробйова, Олександр Плівак, Тетяна Мотронюк

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