САМОЙЛОВ, А. Н.; ШЕВЧЕНКО, И. В. Development of methods for separation of binarized fragments of etching pits of semiconductor wafer. Technology audit and production reserves, [S. l.], v. 3, n. 1(29), p. 60–68, 2016. DOI: 10.15587/2312-8372.2016.71988. Disponível em: https://journals.uran.ua/tarp/article/view/71988. Acesso em: 18 may. 2024.