Reliability prediction of discrete devices by modeling the process of material degradation
DOI:
https://doi.org/10.15587/2312-8372.2015.37697Keywords:
reliability, degradation, discrete device, composite material, algorithm, predictionAbstract
The paper studied the causes of degradation microcircuits that are made of semiconductors for reliability of discrete devices of computer systems. The function of reliability of discrete devices S based on the previously described model of composite materials, reflecting the behavior of the material discrete device with accounting completed physical processes in the material. In the analysis of metal-non-metal, metal-metal systems exists a special area - a thin layer that has excellent physical and chemical properties of major components and affect the reliability analysis of discrete devices. This layer is responsible for the strength of contact and is the link between phases.
To achieve this aim it is analyzed the causes of microcircuit degradation; it is given the classification of used methods for evaluating the reliability; the reliability prediction algorithm of discrete devices is described and the structure of intelligent subsystems of reliability prediction of discrete devices is given. The numerical implementation of these tasks carried out in accordance with the algorithm using existing mathematical software with some additions.
Research of mini-phase interaction models in composites allows to investigate treatment of a composite system in real time without substantial financial and material costs, which in turn allows to predict the causes of material degradation of discrete devices with greater accuracy.
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Copyright (c) 2016 Ольга Віталіївна Кравченко
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