Studying the effect of concentration factors on the process of chemical metallization of powdered polyvinylchloride
DOI:
https://doi.org/10.15587/1729-4061.2018.131446Keywords:
concentration of solutions, optimization, metal-polymer composites, functional composites, polyvinylchloride, chemical reduction, metal fillersAbstract
Influence of concentration of components of chemical metallization solutions on the process of copper reduction on activated polyvinylchloride surface has been studied. It has been established that changes in concentrations of copper sulfate, trilon B and formaldehyde can effectively influence the metallization process. It was shown that the loss of stability of chemical metallization solutions and formation of colloidal solutions makes it is impossible to obtain a metallized polymeric material since copper reduction occurs in the solution volume. Copper reduction in the solution volume occurs because of presence of insoluble colloidal particles of copper hydroxide which are centers of nucleation of copper reduction. At such centers, copper reduction occurs as a result of reaction with formaldehyde and is accompanied by high volumes of hydrogen evolvement. It has been established that the formation of copper coating on an activated polymer surface occurs only with the use of true chemical metallization solutions. The main factor determining stability of chemical metallization solutions is complexing. It was shown that trilon B concentration under 40 mmol/l is not sufficient to bind all Cu2+ ions in a complex which prevents formation of insoluble copper hydroxide in an alkaline medium. The growth of trilon B concentration above 53 mmol/l results in reduction of a portion of copper in a form of hydroxide and formation of true solutions. It has been established that concentration of copper sulfate and alkali exerts the main influence on the mechanism of copper reduction in the case of true solutions. The growth of pH of chemical metallization solutions above 12 brings about an increase in the portion of copper that is reduced by the exchange reaction with zinc.
References
- Moravskyi, V. S. (2016). Metalizatsiya polivinilkhlorydnoho plastykatu khimichnym vidnovlenniam v rozchynakh. Visnyk Natsionalnoho universytetu “Lvivska politekhnika”. Seriya: Khimiya, tekhnolohiya rechovyn ta yikh zastosuvannia, 841, 405–409.
- Moravskyi, V. S., Dziaman, I. Z., Suberliak, S. A., Grytsenko, O. M., Kuznetsova, M. Y. (2017). Features of the production of metal-filled composites by metallization of polymeric raw materials. 2017 IEEE 7th International Conference Nanomaterials: Application & Properties (NAP). doi: 10.1109/nap.2017.8190265
- Chen, H., Ginzburg, V. V., Yang, J., Yang, Y., Liu, W., Huang, Y. et. al. (2016). Thermal conductivity of polymer-based composites: Fundamentals and applications. Progress in Polymer Science, 59, 41–85. doi: 10.1016/j.progpolymsci.2016.03.001
- Bishay, I. K., Abd-El-Messieh, S. L., Mansour, S. H. (2011). Electrical, mechanical and thermal properties of polyvinyl chloride composites filled with aluminum powder. Materials & Design, 32 (1), 62–68. doi: 10.1016/j.matdes.2010.06.035
- Xue, Q. (2004). The influence of particle shape and size on electric conductivity of metal–polymer composites. European Polymer Journal, 40 (2), 323–327. doi: 10.1016/j.eurpolymj.2003.10.011
- Li, H., John, J. V., Byeon, S. J., Heo, M. S., Sung, J. H., Kim, K.-H., Kim, I. (2014). Controlled accommodation of metal nanostructures within the matrices of polymer architectures through solution-based synthetic strategies. Progress in Polymer Science, 39 (11), 1878–1907. doi: 10.1016/j.progpolymsci.2014.07.005
- Nikzad, M., Masood, S. H., Sbarski, I. (2011). Thermo-mechanical properties of a highly filled polymeric composites for Fused Deposition Modeling. Materials & Design, 32 (6), 3448–3456. doi: 10.1016/j.matdes.2011.01.056
- Luyt, A. S., Molefi, J. A., Krump, H. (2006). Thermal, mechanical and electrical properties of copper powder filled low-density and linear low-density polyethylene composites. Polymer Degradation and Stability, 91 (7), 1629–1636. doi: 10.1016/j.polymdegradstab.2005.09.014
- Park, H. J., Badakhsh, A., Im, I. T., Kim, M.-S., Park, C. W. (2016). Experimental study on the thermal and mechanical properties of MWCNT/polymer and Cu/polymer composites. Applied Thermal Engineering, 107, 907–917. doi: 10.1016/j.applthermaleng.2016.07.053
- Pang, H., Xu, L., Yan, D.-X., Li, Z.-M. (2014). Conductive polymer composites with segregated structures. Progress in Polymer Science, 39 (11), 1908–1933. doi: 10.1016/j.progpolymsci.2014.07.007
- Grytsenko, O. M., Suberlyak, O. V., Moravskyі, V. S., Hayduk, A. V. (2016). Investigation of nickel chemical precipitation kinetics. Eastern-European Journal of Enterprise Technologies, 1 (6 (79)), 26–31. doi: 10.15587/1729-4061.2016.59506
- Grytsenko, O., Spišák, E., Dulebová, Ľ., Moravskii, V., Suberlyak, O. (2015). Sorption Capable Film Coatings with Variable Conductivity. Materials Science Forum, 818, 97–100. doi: 10.4028/www.scientific.net/msf.818.97
- Tekce, H. S., Kumlutas, D., Tavman, I. H. (2007). Effect of Particle Shape on Thermal Conductivity of Copper Reinforced Polymer Composites. Journal of Reinforced Plastics and Composites, 26 (1), 113–121. doi: 10.1177/0731684407072522
- Biswas, S., Kar, G. P., Bose, S. (2015). Engineering nanostructured polymer blends with controlled nanoparticle location for excellent microwave absorption: a compartmentalized approach. Nanoscale, 7 (26), 11334–11351. doi: 10.1039/c5nr01785h
- Huang, X., Dai, B., Ren, Y., Xu, J., Zhu, P. (2015). Preparation and Study of Electromagnetic Interference Shielding Materials Comprised of Ni-Co Coated on Web-Like Biocarbon Nanofibers via Electroless Deposition. Journal of Nanomaterials, 2015, 1–7. doi: 10.1155/2015/320306
- Gargama, H., Thakur, A. K., Chaturvedi, S. K. (2015). Polyvinylidene fluoride/nickel composite materials for charge storing, electromagnetic interference absorption, and shielding applications. Journal of Applied Physics, 117 (22), 224903. doi: 10.1063/1.4922411
- Joseph, N., Thomas Sebastian, M. (2013). Electromagnetic interference shielding nature of PVDF-carbonyl iron composites. Materials Letters, 90, 64–67. doi: 10.1016/j.matlet.2012.09.014
- Joseph, N., Singh, S. K., Sirugudu, R. K., Murthy, V. R. K., Ananthakumar, S., Sebastian, M. T. (2013). Effect of silver incorporation into PVDF-barium titanate composites for EMI shielding applications. Materials Research Bulletin, 48 (4), 1681–1687. doi: 10.1016/j.materresbull.2012.11.115
- Bhattacharya, S. K. (1986). Metal-Filled Polymers: Properties and Applications. New York, Basel, 376.
- Delmonte, J. (1990). Metal Polymer Composites. Springer, Boston, MA, 250. doi: 10.1007/978-1-4684-1446-2
- Toker, D., Azulay, D., Shimoni, N., Balberg, I., Millo, O. (2003). Tunneling and percolation in metal-insulator composite materials. Physical Review B, 68 (4). doi: 10.1103/physrevb.68.041403
- Lee, S. H., Yu, S., Shahzad, F., Hong, J. P., Kim, W. N., Park, C. et. al. (2017). Highly anisotropic Cu oblate ellipsoids incorporated polymer composites with excellent performance for broadband electromagnetic interference shielding. Composites Science and Technology, 144, 57–62. doi: 10.1016/j.compscitech.2017.03.016
- Al-Saleh, M. H., Gelves, G. A., Sundararaj, U. (2011). Copper nanowire/polystyrene nanocomposites: Lower percolation threshold and higher EMI shielding. Composites Part A: Applied Science and Manufacturing, 42 (1), 92–97. doi: 10.1016/j.compositesa.2010.10.003
- Kim, H.-R., Fujimori, K., Kim, B.-S., Kim, I.-S. (2012). Lightweight nanofibrous EMI shielding nanowebs prepared by electrospinning and metallization. Composites Science and Technology, 72 (11), 1233–1239. doi: 10.1016/j.compscitech.2012.04.009
- Arranz-Andrés, J., Pérez, E., Cerrada, M. L. (2012). Hybrids based on poly(vinylidene fluoride) and Cu nanoparticles: Characterization and EMI shielding. European Polymer Journal, 48 (7), 1160–1168. doi: 10.1016/j.eurpolymj.2012.04.006
- Arranz-Andrés, J., Pulido-González, N., Fonseca, C., Pérez, E., Cerrada, M. L. (2013). Lightweight nanocomposites based on poly(vinylidene fluoride) and Al nanoparticles: Structural, thermal and mechanical characterization and EMI shielding capability. Materials Chemistry and Physics, 142 (2-3), 469–478. doi: 10.1016/j.matchemphys.2013.06.038
- Moravskyi, V., Dziaman, I., Suberliak, S., Kuznetsova, M., Tsimbalista, T., Dulebova, L. (2017). Research into kinetic patterns of chemical metallization of powderlike polyvinylchloride. Eastern-European Journal of Enterprise Technologies, 4 (12 (88)), 50–57. doi: 10.15587/1729-4061.2017.108462
- Shalkauskas, M. (1985). Himicheskaya metallizaciya plastmass. Leningrad, 144.
Downloads
Published
How to Cite
Issue
Section
License
Copyright (c) 2018 Volodymyr Moravskyi, Anastasiia Kucherenko, Marta Kuznetsova, Iryna Dziaman, Oleksandr Grytsenko, Ludmila Dulebova
This work is licensed under a Creative Commons Attribution 4.0 International License.
The consolidation and conditions for the transfer of copyright (identification of authorship) is carried out in the License Agreement. In particular, the authors reserve the right to the authorship of their manuscript and transfer the first publication of this work to the journal under the terms of the Creative Commons CC BY license. At the same time, they have the right to conclude on their own additional agreements concerning the non-exclusive distribution of the work in the form in which it was published by this journal, but provided that the link to the first publication of the article in this journal is preserved.
A license agreement is a document in which the author warrants that he/she owns all copyright for the work (manuscript, article, etc.).
The authors, signing the License Agreement with TECHNOLOGY CENTER PC, have all rights to the further use of their work, provided that they link to our edition in which the work was published.
According to the terms of the License Agreement, the Publisher TECHNOLOGY CENTER PC does not take away your copyrights and receives permission from the authors to use and dissemination of the publication through the world's scientific resources (own electronic resources, scientometric databases, repositories, libraries, etc.).
In the absence of a signed License Agreement or in the absence of this agreement of identifiers allowing to identify the identity of the author, the editors have no right to work with the manuscript.
It is important to remember that there is another type of agreement between authors and publishers – when copyright is transferred from the authors to the publisher. In this case, the authors lose ownership of their work and may not use it in any way.