Buffer properties of solutions containing Ni(NH3)n2+ in the presence of additional ligand
DOI:
https://doi.org/10.15587/1729-4061.2013.12266Keywords:
Buffer capacity, ammonia complexes, pyrophosphate, citrate, glycine, nickelAbstract
The value of electrolyte рН is one of the major factors influencing its operating abilities and properties of the electrodeposits. Buffer capacity refers to the ability of the electrolyte to keep the pH stable when acids or bases are added. The polyligand containing electrolytes are known to obtain the fine-crystalline electrodeposits that are uniform. The ammonium ions have positive influence on the process of nickel electrodeposition in many electrolytes. Considering these facts the purpose of this work is the assessment of influence of the additional ligands on the buffer capacity of the solutions containing ammonia complexes of nickel. The method of potentiometric titration for the buffer capacity determination is used. The results of buffer capacity determination in the ammonia and ammonia-ammonium solutions containing additional ligands are presented in this paper. There are citrate ions, pyrophosphate ions and glycine, without their excess in the solution. This ligands form complexes with nickel ions. It is shown that the buffer capacity of the solution containing ammonia complexes of nickel increases when we add the second ligands. The results of the researches can be used in the process of optimization of compositions of electrolytes for nickel and its alloys electrodepositionReferences
- Cesiulis, H. Increase in Rate of Electrodeposition and in Ni(II) Concentration in the Bath as a Way to Control Grain Size of Amorphous Nanocrystalline Ni-W Alloys [Текст] / H. Cesiulis, A. Baltutiene, M. Donten, M. L. Donten, Z. Stojek // J. Solid State Electrochem. - 2002 – Vol. 6(4). – P. 237 - 244
- Chovancek, M. Development of a fully buffered molybdate electrolyte for capillary electrophoresis with indirect detection and its use for analysis of anions in Bayer liquor [Текст] / M. Chovancek, P. Choo, M. Macka // Electrophoresis. - 2004. – Vol. 25(3). – P. 437-443
- Poznyak, S. K. Electroplating of Iron Films: Microstructural Effects of Alkaline Baths [Текст] / S. K. Poznyak, V. V. Kharton, J. R. Frade, M.G.S. Ferreira //Mat. Sci. Forum. – 2006. – Vol. 514 – 516. – P. 88-92
- Cesiulis, H. Electrolyte Considerations of Electrodeposited Ni-W Alloys for Microdevice Fabrication [Текст] / H. Cesiulis, E. J. Podlaha-Murphy // Mat. Sci. - 2003. - Vol. 9(4). – P. 329-333
- Зуен, Ву Тхи. Кинетика электроосаждения никеля из растворов различного анионного состава [Текст] / Ву Тхи Зуен, О. В. Долгих, Н. В. Соцкая, Е. А. Котлярова //Конденсированные среды и межфазные границы. - 2009. – Т. 11(1). – С. 37-46
- Majzelis, А.A. The effect of architecture of the Cu/(Ni-Cu) multilayer coatings on their microhardness [Текст] / А.A. Majzelis, B.I. Bairachniy, L.V. Trubnikova, B.A. Savitsky // Functional Materials. – 2012. – Vol. 19(2). – P. 238 - 244
- Kiss, T. Critical survey of stability constants of complexes of glycine [Текст] / Kiss T., Sóvágó I., Gergely A. // Pure & Applied Chemistry. - 1991. - Vol. 63(4). – P. 597-638
- Maizelis, A.A. The influence of multilayered copper-nikel coatings formation circumstances on the corrosion resistance and mechanical properties [Текст] / L.V. Trubnikova, B.I. Bayrachny, A.A. Maizelis // Electrochemical Technologies and Materials for 21st century: 9th International Frumkin Symposium, 24 – 29 oct. 2010. : аbstracts. – Moscow, 2010. – P. 172
- Майзелис, А.А. Влияние архитектуры мультислойных покрытий Cu/(Ni-Cu) на их пористость [Текст] / А.А. Майзелис, Б.И. Байрачный, Л.В. Трубникова // Восточно-Европейский журнал передовых технологий.–2012.–№ 2/5 (56).–C.4-6
- Майзелис, А.А. Равномерность мультислойных Cu/(Ni-Cu) покрытий по толщине [Текст] / А.А. Майзелис, Б.И. Байрачный, Л.В. Трубникова, В.Н. Иващенко, В.М. Сорочинский // Восточно-Европейский журнал передовых технологий. – 2012. – № 4/5 (58). – C. 21-24.
- Cesiulis, H., Baltutiene A., Donten, M., Donten, M.L., Stojek, Z. (2002). Increase in Rate of Electrodeposition and in Ni(II) Concentration in the Bath as a Way to Control Grain Size of Amorphous Nanocrystalline Ni-W Alloys. J. Solid State Electrochem., 6(4), 237 – 244.
- Chovancek, M., Choo, P., Macka, M. (2004). Development of a fully buffered molybdate electrolyte for capillary electrophoresis with indirect detection and its use for analysis of anions in Bayer liquor. Electrophoresis, 25(3), 437–443
- Poznyak, S. K., Kharton, V. V., Frade, J. R., Ferreira, M.G.S. (2006). Electroplating of Iron Films: Microstructural Effects of Alkaline Baths Mat. Sci. Forum, 514 – 516, 88–92.
- Cesiulis, H., Podlaha-Murphy, E.J. (2003). Electrolyte Considerations of Electrodeposited Ni-W Alloys for Microdevice Fabrication. Mat. Sci., 9(4), 329–333.
- Zuyen, Vu Thi, Dolgikh, O.V., Sotskaya, N.V., Kotlyarova, E.A. (2009). Kinetics of Nickel Electrodeposition from Solutions of Different Anionic Composition. Condensed environments and interphase boundary, 11(1), 37–46.
- Majzelis, А.A., Bairachniy, B.I., Trubnikova, L.V., Savitsky, B.A. (2012). The effect of architecture of the Cu/(Ni-Cu) multilayer coatings on their microhardness. Functional Materials, 19(2), 238 – 244.
- Kiss, T., Sovago, I., Gergely, A. (1991). Critical survey of stability constants of complexes of glycine. Pure & Applied Chemistry, 63, 597–638.
- Maizelis, A.A., Trubnikova, L.V., Bayrachny, B.I. (2010). The influence of multilayered copper-nikel coatings formation circumstances on the corrosion resistance and mechanical properties. Electrochemical Technologies and Materials for 21st century: 9th International Frumkin Symposium. Moscow: аbstracts, 172.
- Maizelis, А.А., Bairachniy, B.I., Trubnikova, L.V. (2012). The effect of architecture of the Cu/(Ni-Cu) multilayer coatings on their porosity. Eastern-European Journal of Enterprise Technologies, 2/5 (56), 4–6.
- Maizelis, А.А., Bairachniy, B.I., Ivastenko, V.N., Sorochinskiy, V.M. (2012). The thickness uniformity of the Cu/(Ni-Cu) multilayer coating. Eastern-European Journal of Enterprise Technologies, 4/5 (58), 21–24.
Downloads
Published
How to Cite
Issue
Section
License
Copyright (c) 2014 Дар’я Василівна Северин, Олег Володимирович Назаренко, Антоніна Олександрівна Майзеліс, Валентина Мефодіївна Артеменко, Лариса Валентинівна Трубнікова
This work is licensed under a Creative Commons Attribution 4.0 International License.
The consolidation and conditions for the transfer of copyright (identification of authorship) is carried out in the License Agreement. In particular, the authors reserve the right to the authorship of their manuscript and transfer the first publication of this work to the journal under the terms of the Creative Commons CC BY license. At the same time, they have the right to conclude on their own additional agreements concerning the non-exclusive distribution of the work in the form in which it was published by this journal, but provided that the link to the first publication of the article in this journal is preserved.
A license agreement is a document in which the author warrants that he/she owns all copyright for the work (manuscript, article, etc.).
The authors, signing the License Agreement with TECHNOLOGY CENTER PC, have all rights to the further use of their work, provided that they link to our edition in which the work was published.
According to the terms of the License Agreement, the Publisher TECHNOLOGY CENTER PC does not take away your copyrights and receives permission from the authors to use and dissemination of the publication through the world's scientific resources (own electronic resources, scientometric databases, repositories, libraries, etc.).
In the absence of a signed License Agreement or in the absence of this agreement of identifiers allowing to identify the identity of the author, the editors have no right to work with the manuscript.
It is important to remember that there is another type of agreement between authors and publishers – when copyright is transferred from the authors to the publisher. In this case, the authors lose ownership of their work and may not use it in any way.
