Analysis of the model of interdependence of thermoelement branch geometry and reliability indicators of the single-stage cooler
DOI:
https://doi.org/10.15587/1729-4061.2017.85322Keywords:
reliability indicators, failure rate, thermoelectric cooling devices, model, geometry of thermoelementsAbstract
The effect of the thermoelement branch geometry on the main reliability indicators of the single-stage thermoelectric cooling device for a variety of temperature gradients in the range of practical use of coolers in various operation modes has been considered. To achieve the assigned objective of bettering reliability indicators of thermoelectric coolers, a reliability-oriented model has been developed. The model relates the failure rate and the probability of failure-free operation with the geometry of thermoelement branches, energy indicators and operation conditions. The analysis was performed for a variety of temperature gradients, a fixed tempo load and various modes of operation.
Analysis of the developed model has shown the possibility of improvement of the reliability indicators of the single-stage thermoelectric coolers by selection of the thermoelement branch geometry. Analytical relations between the failure rate and the geometry of thermoelements, energy indicators of the coolers have been established. It was shown that the choice of the thermoelement geometry can give more than a two-fold reduction in the failure rate.
The developed model which can be used in computer-aided design enables development of single-stage thermoelectric coolers with consideration of restrictive requirements to size, weight, power consumption with a possibility of choice of a compromise design variantReferences
- Tsarev, A. V., Chugunkov, V. V. (2008). Investigation of thermoelectric devices characteristics for temperature control systems launch facilities. Actual problems of Russian cosmonautics: Materials of XXXII Academic Conference on Astronautics. Moscow: The Board of RAS, 320–321.
- Zhang, L., Wu, Z., Xu, X., Xu, H., Wu, Y., Li, P., Yang, P. (2010). Approach on thermoelectricity reliability of board-level backplane based on the orthogonal experiment design. International Journal of Materials and Structural Integrity, 2-4, 170. doi: 10.1504/ijmsi.2010.035205
- Zebarjadi, M., Esfarjani, K., Dresselhaus, M. S., Ren, Z. F., Chen, G. (2012). Perspectives on thermoelectrics: from fundamentals to device applications. Energy & Environmental Science, 5 (1), 5147–5162. doi: 10.1039/c1ee02497c
- Rowe, D. M. (Ed.) (2012). Materials, Preparation, and Characterization in Thermoelectrics. Vol. 1. Boca Raton: CRC Press, 552.
- Choi, H.-S., Seo, W.-S., Choi, D.-K. (2011). Prediction of reliability on thermoelectric module through accelerated life test and Physics-of-failure. Electronic Materials Letters, 7 (3), 271–275. doi: 10.1007/s13391-011-0917-x
- Wereszczak, A. A., Wang, H. (2011). Thermoelectric Mechanical Reliability. Vehicle Technologies Annual Merit Reviewand Peer Evaluation Meeting. Arlington, 18.
- Zaykov, V. P., Moiseev, V. F. (2001). Influence of thermoelectric devices modes for its reliability. Technology and designing in the electronic equipment, 4-5, 30–32.
- Zajkov, V. P., Meshherjakov, V. I., Gnatovskaja, A. A. (2011). Influence of thermal loading on indicators of reliability of the two-cascade thermoelectric cooling devices. Eastern-European Journal of Enterprise Technologies, 4 (9 (52)), 34–38. Available at: http://journals.uran.ua/eejet/article/view/1477/1375
- Singh, R. (2008). Experimental Characterization of Thin Film Thermoelectric Materials and Film Deposition VIA Molecular Beam Epitaxy. University of California, 54.
- Gromov, G. (2014). Volumetric or thin-film thermoelectric modules. Components and Technologies, 9.
- Zaikov, V. P., Kirshova, L. A., Moiseev, V. F. (2009). Prediction of reliability on thermoelectric cooling devices. Kn. 1. Single-stage devices. Odessa: Politehperiodika, 108.
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Copyright (c) 2017 Vladimir Zaikov, Vladimir Mescheryakov, Yurii Zhuravlov
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