Features of schematic and physical and topological design of analog integrated comparators

Authors

DOI:

https://doi.org/10.15587/1729-4061.2014.26251

Keywords:

operational amplifier, single-limit analog comparator and Schmitt trigger, C-MOS

Abstract

In practice, devices, which form either voltage with opposite polarity at the output at almost equal absolute values or voltage with the same polarity are the most widely used. The first option is typical for using as a comparison circuit of operational amplifier (OP), and the second – in using specialized integrated circuits. In the second case, the output voltages of the comparator are consistent in magnitude and polarity with the signals, used in digital technology.

Based on the above, we can say that the input signal of the comparator is of the analog nature, and output – digital. Consequently, comparators often act as elements of communication between analog and digital devices, i.e. act as analog-digital converters (ADC).

Due to the fact that both analog and digital signals are used in modern telecommunication systems, we have both analog and digital comparators, respectively. Digital comparator differs from analog in that it is designed to compare two numbers that are given in the form of binary codes.

Author Biography

Степан Петрович Новосядлий, Carpathian National University. Stefanik Str. Shevchenko, 57, Ivano-Frankivsk, Ukraine, 76025

Doctor of Technical Sciences, Professor

Department of Computer Engineering and Electronics

References

  1. Zhuikov, V. Y, Boyko, V. S, Zori, A. A. (2002). Circuitry electronic systems: Textbook in two volumes, 408.
  2. Senko, E. V, Panasenko, M. V. (2000). Electronics and microcircuitry, 300.
  3. Senko, E. V., Panasenko, M. V. (2002). Electronics and microcircuitry, 510.
  4. Novosyadlyy, S. P. (2010). Sub-nanomykron technology structures LSI. Ivano-Frankivsk City NV, 456.
  5. Novosyadlyy, S. P. (2003). Physical and technological bases submicron VLSI. Ivano-Frankivsk Seven, 52–54.
  6. Novosyadlyy, S. P. (2002). Radiation technology in the formation, submicron VLSI structures, 1003–1013.
  7. Novosyadlyy, S. P. (2002). Formation of silicon epitaxial structures for the combined VLSI, 353–365.
  8. Novosyadlyy, S. P. (2002). Technology CAD based test structures, 3 (31), 179–189.
  9. Novosyadlyy, S. P, Melnyk, L. V, Kіndrat, T. P. (2013). Physical – technical features of formation of gallium arsenide submicron metallization structures by ion milling. Eastern-European Journal of Enterprise Technologies, 4 (5), 1–6.
  10. Ifeachor, E. C., Jervis, B. W., Morris, E. L., Allen, E. M., Hudson, N. R. (1986). A new microcomputer-based online ocular artefact removal (OAR) system. IEE Proceedings A Physical Science, Measurement and Instrumentation, Management and Education, Reviews, 133(5), 291. doi:10.1049/ip-a-1.1986.0040
  11. Ifeachor, E. C., Hellyar, M. T., Mapps, D. J., Allen, E. M. (1990). Knowledge-based enhancement of human EEG signals. IEE Proceedings F Radar and Signal Processing, 137(5), 302. doi:10.1049/ip-f-2.1990.0046
  12. Harris, S. P., Ifeachor, E. C. (1998). Automatic design of frequency sampling filters by hybrid genetic algorithm techniques. IEEE Transactions on Signal Processing, 46 (12), 3304–3314. doi:10.1109/78.735305
  13. Simon, V. V., Kornilov, L. (1988). Equipment of ion implantation. Radio and Communications, 354.
  14. Ryssel, H. Ruge, I. (1983). Ion implantation. Science, 360.
  15. Boltaks, B. I. Kolotov, M. N. Skoretyna, E. A. (1983). Deep centers in gallium arsenide tied up with their own structural defects, 10.
  16. Afanasiev, V. A. Duhvskyy, M. Krasov, G. A. (1984). Equipment for impulse heat treatment of semiconductor materials, 56–58.
  17. Okamoto, T. (1985). Devices of ion implantation, 1322–1325.

Published

2014-08-13

How to Cite

Новосядлий, С. П. (2014). Features of schematic and physical and topological design of analog integrated comparators. Eastern-European Journal of Enterprise Technologies, 4(5(70), 4–15. https://doi.org/10.15587/1729-4061.2014.26251