LED PCB thermal simulation using FLOEFD

Authors

  • Anna Andonova Technical University of Sofia, Bulgaria Kl. Ohridski 8, Sofia, 1797, Bulgaria

DOI:

https://doi.org/10.15587/1729-4061.2012.6013

Keywords:

LED, thermal simulation, optimization, thermal management, PCB

Abstract

This paper presents work done to create a high power light emitted diode (LED) package on a PCB and a double layer FR4. Firstly, a detailed model of an LED package-on-substrate is created. Then the model is optimized with respect to kind, number and location of the thermal vias, width of thermal paths and LED power dissipation. The method CFD (computational fluid dynamics) via the software Mentor Graphics FLOEFD is used as a tool to assist in the design of the power LED for the real application. The results show that the models agree well with the actual measured value. A major advantage is saving time and money for the development of reliable design of LED modules

Author Biography

Anna Andonova, Technical University of Sofia, Bulgaria Kl. Ohridski 8, Sofia, 1797

Professor

Department of Microelectronics

References

  1. Cheng Y., Xu G., Zhu D., Zhu W., Luo L., Thermal Analysis for Indirect Liquid Cooled MultiChip Module Using Computational Fluid Dynamic Simulation and Response Surface Methodology, IEEE Trans. on Comp. and Packaging Tech, 2006, Vol.29, No 1, pp. 39-46.
  2. http://wikihelp.autodesk.com/Simulation_CFD/enu/2013/Help/0407-Learning407/0769-Applicat769/0778-LED_and_778/0785-Unit_2%3A_785/0786-Modeling786, Modeling Strategies for LED Applications, 2012 (last opened in October, 2012).
  3. Bu J., Wang P., Ai L., Sang X., Li Y., Thermal Resistance and Heat Dissipation of LED PCB with Thermal Vias, Advanced Materials Research, 2011, Vol. 287 – 290, pp. 789-792

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Published

2012-12-25

How to Cite

Andonova, A. (2012). LED PCB thermal simulation using FLOEFD. Eastern-European Journal of Enterprise Technologies, 6(11(60), 59–61. https://doi.org/10.15587/1729-4061.2012.6013

Issue

Section

Radio engineering information tools