LED PCB thermal simulation using FLOEFD
DOI:
https://doi.org/10.15587/1729-4061.2012.6013Keywords:
LED, thermal simulation, optimization, thermal management, PCBAbstract
This paper presents work done to create a high power light emitted diode (LED) package on a PCB and a double layer FR4. Firstly, a detailed model of an LED package-on-substrate is created. Then the model is optimized with respect to kind, number and location of the thermal vias, width of thermal paths and LED power dissipation. The method CFD (computational fluid dynamics) via the software Mentor Graphics FLOEFD is used as a tool to assist in the design of the power LED for the real application. The results show that the models agree well with the actual measured value. A major advantage is saving time and money for the development of reliable design of LED modulesReferences
- Cheng Y., Xu G., Zhu D., Zhu W., Luo L., Thermal Analysis for Indirect Liquid Cooled MultiChip Module Using Computational Fluid Dynamic Simulation and Response Surface Methodology, IEEE Trans. on Comp. and Packaging Tech, 2006, Vol.29, No 1, pp. 39-46.
- http://wikihelp.autodesk.com/Simulation_CFD/enu/2013/Help/0407-Learning407/0769-Applicat769/0778-LED_and_778/0785-Unit_2%3A_785/0786-Modeling786, Modeling Strategies for LED Applications, 2012 (last opened in October, 2012).
- Bu J., Wang P., Ai L., Sang X., Li Y., Thermal Resistance and Heat Dissipation of LED PCB with Thermal Vias, Advanced Materials Research, 2011, Vol. 287 – 290, pp. 789-792
Downloads
Published
How to Cite
Issue
Section
License
Copyright (c) 2014 Anna Andonova
This work is licensed under a Creative Commons Attribution 4.0 International License.
The consolidation and conditions for the transfer of copyright (identification of authorship) is carried out in the License Agreement. In particular, the authors reserve the right to the authorship of their manuscript and transfer the first publication of this work to the journal under the terms of the Creative Commons CC BY license. At the same time, they have the right to conclude on their own additional agreements concerning the non-exclusive distribution of the work in the form in which it was published by this journal, but provided that the link to the first publication of the article in this journal is preserved.
A license agreement is a document in which the author warrants that he/she owns all copyright for the work (manuscript, article, etc.).
The authors, signing the License Agreement with TECHNOLOGY CENTER PC, have all rights to the further use of their work, provided that they link to our edition in which the work was published.
According to the terms of the License Agreement, the Publisher TECHNOLOGY CENTER PC does not take away your copyrights and receives permission from the authors to use and dissemination of the publication through the world's scientific resources (own electronic resources, scientometric databases, repositories, libraries, etc.).
In the absence of a signed License Agreement or in the absence of this agreement of identifiers allowing to identify the identity of the author, the editors have no right to work with the manuscript.
It is important to remember that there is another type of agreement between authors and publishers – when copyright is transferred from the authors to the publisher. In this case, the authors lose ownership of their work and may not use it in any way.