Model of the cascade thermoelectric cooling devices in the mode of the largest energy efficiency
DOI:
https://doi.org/10.15587/1729-4061.2016.85395Keywords:
thermoelectric devices, indicators of reliability, temperature drop, energy effectivenessAbstract
We developed and analyzed a model of the interrelation between the reliability indicators of the cascade thermoelectric coolers that operate under regime of the largest energy effectiveness at the serial electrical connection of cascades and the design and energy indicators of cooler.
It is demonstrated that the application of cascade thermoelectric devices, built on the basis of standardized modules, is predetermined not only by attaining maximal possible level of cooling but by the increase in efficiency as well. In this case, it is important to obtain maximally possible energy effectiveness at the assigned temperature drop, to select current regime at the assigned design of cooler and to estimate reliability indicators.
We obtained ratios for determining the optimum magnitude of relative operating current, which corresponds to the maximum value of refrigerating coefficient of the cooler with the assigned design and temperature drop. They are functional dependences, which connect basic parameters of the two-cascade thermoelectric coolers of the assigned design with relative operating current of the first cascade in the form of algebraic equations of the 4th degree.
The conducted analysis of the model demonstrated that there is an optimum ratio of the number of thermoelements in the cascades, which corresponds to the maximum refrigerating coefficient at the assigned temperature drop. The obtained ratios make it possible to determine both the basic parameters and the reliability indicators of the cascade thermoelectric cooler of the assigned design. This provides the possibility to evaluate the efficiency of functioning and prediction of the indicators of reliability in the regime of maximum energy effectiveness under varied conditions of operation.References
- Zebarjadi, M., Esfarjani, K., Dresselhaus, M. S., Ren, Z. F., Chen, G. (2012). Perspectives on thermoelectrics: from fundamentals to device applications. Energy & Environmental Science, 5 (1), 5147–5162. doi: 10.1039/c1ee02497c
- Riffat, S. B., Ma, X. (2004). Improving the coefficient of performance of thermoelectric cooling systems: a review. International Journal of Energy Research, 28 (9), 753–768. doi: 10.1002/er.991
- Sootsman, J. R., Chung, D. Y., Kanatzidis, M. G. (2009). New and Old Concepts in Thermoelectric Materials. Angewandte Chemie International Edition, 48 (46), 8616–8639. doi: 10.1002/anie.200900598
- Jurgensmeyer, A. L. (2011). High Efficiency Thermoelectric Devices Fabricated Using Quantum Well Confinement Techniques. Colorado State University, 59.
- Singh, R. (2008). Experimental Characterization of Thin Film Thermoelectric Materials and Film Deposition VIA Molecular Beam Epitaxy. University of California, 158.
- Brown, S. R., Kauzlarich, S. M., Gascoin, F., Snyder, G. J. (2006). Yb14MnSb11: New High Efficiency Thermoelectric Material for Power Generation. Chemistry of Materials, 18 (7), 1873–1877. doi: 10.1021/cm060261t
- Iversen, B. B., Palmqvist, A. E. C., Cox, D. E., Nolas, G. S., Stucky, G. D., Blake, N. P., Metiu, H. (2000). Why are Clathrates Good Candidates for Thermoelectric Materials? Journal of Solid State Chemistry, 149 (2), 455–458. doi: 10.1006/jssc.1999.8534
- Shevelev, A. V. (2010). Nanostructured thermoelectric materials. Moscow: Research and Education Center for Nanotechnology MSU Lomonosova, 58.
- Nesterov, S. B., Holopkin, A. I. (2014). Assessing the possibility of increasing the thermoelectric figure of merit of nanostructured semiconductor materials for cooling technology. Cooling technology, 5, 40–43.
- Kozhemyakin, G. N., Turpentine, S. J., Kroot, Y. M., Parashchenko, A. N., Ivanov, O. N., Soklakova, O. N. (2014). Nanostructured bismuth and antimony tellurides for thermoelectric heat pump. Thermoelectricity, 1, 37–47.
- Wereszczak, A. A., Wang, H. (2011). Thermoelectric Mechanical Reliability. Vehicle Technologies Annual Merit Reviewand Peer Evaluation Meeting. Arlington, 18.
- Melcor Thermoelectric Cooler Reliability Report (2002). Melcor Corporation, 36.
- Simkin, A. V., Biryukov, A. V., Repnikov, N. I., Ivanov, O. N. (2012). Influence of the contact surface condition on the adhesive strength of switching layers thermocouples on the basis of extruded bismuth telluride. Thermoelectrisity, 2, 13–19.
- Zaikov, V. P., Kirshova, L. A., Moiseev, V. F. (2009). Prediction of reliability on thermoelectric cooling devices. Single-stage devices. Odessa: Politehperiodika, 120.
Downloads
Published
How to Cite
Issue
Section
License
Copyright (c) 2016 Vladimir Zaikov, Vladimir Mescheryakov, Yurii Zhuravlov
This work is licensed under a Creative Commons Attribution 4.0 International License.
The consolidation and conditions for the transfer of copyright (identification of authorship) is carried out in the License Agreement. In particular, the authors reserve the right to the authorship of their manuscript and transfer the first publication of this work to the journal under the terms of the Creative Commons CC BY license. At the same time, they have the right to conclude on their own additional agreements concerning the non-exclusive distribution of the work in the form in which it was published by this journal, but provided that the link to the first publication of the article in this journal is preserved.
A license agreement is a document in which the author warrants that he/she owns all copyright for the work (manuscript, article, etc.).
The authors, signing the License Agreement with TECHNOLOGY CENTER PC, have all rights to the further use of their work, provided that they link to our edition in which the work was published.
According to the terms of the License Agreement, the Publisher TECHNOLOGY CENTER PC does not take away your copyrights and receives permission from the authors to use and dissemination of the publication through the world's scientific resources (own electronic resources, scientometric databases, repositories, libraries, etc.).
In the absence of a signed License Agreement or in the absence of this agreement of identifiers allowing to identify the identity of the author, the editors have no right to work with the manuscript.
It is important to remember that there is another type of agreement between authors and publishers – when copyright is transferred from the authors to the publisher. In this case, the authors lose ownership of their work and may not use it in any way.