Comparative analysis of surface finishes of printed circuit boards
DOI:
https://doi.org/10.15587/1729-4061.2013.9312Keywords:
surface finishes, PCB, HASL, ENIG, OSP.Abstract
This article describes surface finishes which are the most common and well-established at present time at the assembly operations of electronic products. The process of further improvement of these finishes is continuing, and actively develops unlike their less common counterparts - different finishes based on palladium and galvanically deposited NiSn and SnAg finishes. Outside of the scope of this article remain important issues, such as a detailed examination of a number of lead-free coatings and methods for solderability testing, measuring the surface resistance of the coating and the shear strength of solder joints in compliance with international standards. These issues will be covered in future articles on these subjects.References
- Standart: J-STD-003 “Solderability Tests for Printed Boards”;
- Standart IPC 2221 “Generic Standard on Printed Board Design”;
- Standart IPC-7095A “Design and Assembly Process Implementation for BGAs” ;
- “Alternative Technologies for Surface Finishing” Pollution Prevention Information Clearinghouse and U.S. Environmental Protection Agency, website: www.epa.gov/opptintr/library/ppicdist.htm
- Beauvillier, Luc; Holle Galyon; Matt Stevenson; Darren Hitchcock –“PWB Surface Finishes” –SMTA Meeting. March 16th, 2005;
- Kermit Aguayo. “Selection of PWB finish” - Process Sciences Inc., 2008
- Beauvillier, Luc –“The Quest for the Ultimate Surface Finish”. Published in “Printed Circuit Design” magazine; Jun 2002, Vol. 19, Issue 6, p 27;
- F. D. Bruce Houghton. “Solving the ENIG Black Pad Problem: An ITRI Report on Round 2” PWBRC;
- Duane Benson. “Black Pad — And Then Some SMT”, smt.pennnet.com;
- “The Quest for the Ultimate Surface Finish”, printed circuit design – June, 2002. www.merix.com;
- “Surface Finish Options” Merix Corporation. www.merix.com;
- Solberg, Vern. “Specifying Base Materials for SMT Circuit Boards”, Part 3 SMT – September, 2005
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