Method of BGA electronic components connecting to automated measuring complexes

Authors

  • Игорь Шакирович Невлюдов Kharkiv National University of Radio Electronics, Lenina avenue 16, Kharkiv, 61166, Ukraine
  • Виктор Андреевич Палагин Kharkiv National University of Radio Electronics, Lenina avenue 16, Kharkiv, 61166, Ukraine
  • Ирина Владимировна Жарикова Kharkiv National University of Radio Electronics, Lenina avenue 16, Kharkiv, 61166, Ukraine

DOI:

https://doi.org/10.15587/1729-4061.2013.9490

Keywords:

electrical testing, BGA electronic component, Multiprobes connecting device, MEMS interface, Automated measuring complexes.

Abstract

Testing of multilayers commutative boards and electronic components electrical parameters is an important manufacturing operation. The devices for connecting some thousands test points on units under test to automatic testing equipment are described in report.
Was found nontraditional form for probes and method it pressing to contact lands on boards and connecting to matrix leads electronic components BGA/CSP. The test fixture with doubling or multitudinous probes to each testing point on unit under test give opportunity for self-monitoring contact of each probe to test point.
Three disconnections take place in test fixtures: the first, between unit under test and probes; the second, between transfer fixture-cable to tester; the third, in entrance of testing equipment. Proposed MEMS interface solves this problem by way elimination two disconnection from three by using whole test fixture from probes of fixture to automate testing equipment.
Designed connecting device are made with synthesis of known flexibility multilayers printed boards, matrix leads BGA/CSP components and air cushion press technologies. Such test fixtures are simple and cheap.
Described test fixture can be used as intellect interface between multilayers commutative boards, electronic components and testing equipment at the enterprises-manufacturers of electronic means for electric parameters testing and also for replacement of the old or expensive equipment.

Author Biographies

Игорь Шакирович Невлюдов, Kharkiv National University of Radio Electronics, Lenina avenue 16, Kharkiv, 61166

Professor, Head of the Department

Department of Technology and Automation of Computing and Radio Electronic Devices Production

Виктор Андреевич Палагин, Kharkiv National University of Radio Electronics, Lenina avenue 16, Kharkiv, 61166

Professor

Department of Technology and Automation of Computing and Radio Electronic Devices Production

Ирина Владимировна Жарикова, Kharkiv National University of Radio Electronics, Lenina avenue 16, Kharkiv, 61166

Post-graduate student

Department of Technology and Automation of Computing and Radio Electronic Devices Production

References

  1. Ching-Mai, Ko. Надежность тестирования BGA-компонентов [Текст] / Ko Ching-Mai, Chen Ming-Kun, Huang Yu-Jung, Fu Shen-Li // Технологии в электронной промышленности. – 2009. – №4. – С. 38-42.
  2. Патент України № 95190. Мікроелектромеханічний багатозондовий підмикальний пристрій [Текст] / Борщев В. Н., Жарікова І. В., Кощій Л. Д., Лістратенко О. М., Невлюдов І. Ш., Палагін В. А., Проценко М. А., Разумов-Фризюк Є. А., Старченко О. П., Тертишний С. М., Тимчук І. Т., опубл. 11.07.2011, Бюл. № 13.
  3. Патент України № 98539. МЕМС-інтерфейс багатоточкових автоматичних контролюючих комплексів [Текст] / Невлюдов І. Ш., Палагін В. А., Размов-Фризюк Є. А., Жарікова І. В., Костенко З. І., опубл. 25.05.2012, Бюл. № 10.

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Published

2013-02-05

How to Cite

Невлюдов, И. Ш., Палагин, В. А., & Жарикова, И. В. (2013). Method of BGA electronic components connecting to automated measuring complexes. Eastern-European Journal of Enterprise Technologies, 1(9(61), 4–7. https://doi.org/10.15587/1729-4061.2013.9490

Issue

Vol. 1 No. 9(61) (2013): Information and control systems

Section

Information and controlling system

License

Copyright (c) 2014 Игорь Шакирович Невлюдов, Виктор Андреевич Палагин, Ирина Владимировна Жарикова

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