Development of the laser-foundry process for manufacture of bimetals
DOI:
https://doi.org/10.15587/1729-4061.2018.139483Keywords:
bimetals, thermal processes, laser irradiation, induction heating, melting zone, metallurgical bondAbstract
The new highly effective method for the production of bimetal sheets was proposed. According to a thin surface layer of the functional component of the bimetal moving at a certain speed on a certain area is melted by the concentrated laser radiation. Simultaneously, the pre-prepared solutions of the bimetal base are fed to the zone of its action from a special dispensing device with a specified flow rate, resulting in a reliable connection between them when cooling.
The method is characterized by high productivity and universality of the process of manufacturing a wide range of bimetals of various purposes, the great strength of the grip of their components, the possibility of complete automation. The thermal processes occurring in the surface layer of the functional composition of bimetal from 40H13 stainless steel (AISI 420) under different laser radiation conditions are analyzed. The parameters of laser irradiation, which provide submelting of the 50 mm wide surface layer to a depth of 50–100 microns (the radiation power is 8.5 kW, the speed of the movement is 1 m/min) are determined. The conditions of feeding of the molten metal of the base of St.3 structural carbon steel (AISI A284Gr.D) (the height of the melt column 7.6 mm, the size of the outlet 50×3 mm) on the fused functional layer, which provide the formation of the bimetal with the specified dimensional characteristics, are substantiated.
The productivity of the considered laser-foundry process is determined by the parameters of scanning and power of the laser beam, the cost characteristics of the melt of one of the components, the speed of relative displacement. The fusion zone formed during cooling and relative displacement of the components of the bimetal causes the metallurgical bond between them. This allows producing bimetallic products of the required quality.
References
- Yushchenko, K. A., Kuznetsov, V. D., Korzh, V. M. (2007). Surface engineering. Kyiv: Naukova dumka, 558.
- Groover, M. P. (2010). Fundamentals of Modern Manufacturing: Materials, Processes, and Systems. Wiley & Sons, Inc., USA, 1025.
- Yousefi Mehr, V., Toroghinejad, M. R., Rezaeian, A. (2014). The effects of oxide film and annealing treatment on the bond strength of Al–Cu strips in cold roll bonding process. Materials & Design, 53, 174–181. doi: https://doi.org/10.1016/j.matdes.2013.06.028
- Jiang, W., Fan, Z., Li, C. (2015). Improved steel/aluminum bonding in bimetallic castings by a compound casting process. Journal of Materials Processing Technology, 226, 25–31. doi: https://doi.org/10.1016/j.jmatprotec.2015.06.032
- DebRoy, T., Wei, H. L., Zuback, J. S., Mukherjee, T., Elmer, J. W., Milewski, J. O. et. al. (2018). Additive manufacturing of metallic components – Process, structure and properties. Progress in Materials Science, 92, 112–224. doi: https://doi.org/10.1016/j.pmatsci.2017.10.001
- LLC «STEEL WORK». Available at: https://steel-work.net/
- Cao, Y.-L., Jiang, Z.-H., Dong, Y.-W., Deng, X., Medovar, L., Stovpchenko, G. (2018). Research on the Bimetallic Composite Roll Produced by an Improved Electroslag Cladding Method: Mathematical Simulation of the Power Supply Circuits. ISIJ International, 58 (6), 1052–1060. doi: https://doi.org/10.2355/isijinternational.isijint-2017-703
- Chu, Q. ling, Zhang, M., Li, J. hong, Jin, Q., Fan, Q. yang, Xie, W. wei et. al. (2015). Experimental investigation of explosion-welded CP-Ti/Q345 bimetallic sheet filled with Cu/V based flux-cored wire. Materials & Design, 67, 606–614. doi: https://doi.org/10.1016/j.matdes.2014.11.008
- Romanenko, V. V., Lykhoshva, V. P., Shatrava, O. P., Golovko, L. F., Kryvtsun, I. V. (2014). Pat. No. 96621 UA. The device for laser-foundry manufacture of bimetals. МPK: B23K 26/352. No. u201409701; declareted: 04.09.2014; published: 10.02.2015, Bul. No. 3, 5.
- Karbasi, H. (2010). COMSOL Assisted Simulation of Laser Engraving. Excerpt from the Proceedings of the COMSOL Conference 2010. Boston.
Downloads
Published
How to Cite
Issue
Section
License
Copyright (c) 2018 Leonid Golovko, Serhii Salii, Mykhaylo Bloshchytsyn, Walid Alnusirat
This work is licensed under a Creative Commons Attribution 4.0 International License.
The consolidation and conditions for the transfer of copyright (identification of authorship) is carried out in the License Agreement. In particular, the authors reserve the right to the authorship of their manuscript and transfer the first publication of this work to the journal under the terms of the Creative Commons CC BY license. At the same time, they have the right to conclude on their own additional agreements concerning the non-exclusive distribution of the work in the form in which it was published by this journal, but provided that the link to the first publication of the article in this journal is preserved.
A license agreement is a document in which the author warrants that he/she owns all copyright for the work (manuscript, article, etc.).
The authors, signing the License Agreement with TECHNOLOGY CENTER PC, have all rights to the further use of their work, provided that they link to our edition in which the work was published.
According to the terms of the License Agreement, the Publisher TECHNOLOGY CENTER PC does not take away your copyrights and receives permission from the authors to use and dissemination of the publication through the world's scientific resources (own electronic resources, scientometric databases, repositories, libraries, etc.).
In the absence of a signed License Agreement or in the absence of this agreement of identifiers allowing to identify the identity of the author, the editors have no right to work with the manuscript.
It is important to remember that there is another type of agreement between authors and publishers – when copyright is transferred from the authors to the publisher. In this case, the authors lose ownership of their work and may not use it in any way.
