Assessment the effect of dies stamping process parameters on the performance of spring-back and spring-go defects in galvanized steel sheet materials
DOI:
https://doi.org/10.15587/1729-4061.2025.324951Keywords:
optimization, spring defect, dies stamping, manufacturing, punch angle, galvanized materialAbstract
Dies stamping is an important manufacturing process and widely applied in the modern industrial era. It provides convenience in the production process and rapid shape modification, especially for sheet materials. However, the quality occasionally experiences dimensional change which defined as spring back (SB) and spring go (SG). This study conducted an analysis related to the factors that contribute to the defect from dies stamping. The work used galvanized sheet and processed through V-bending using thickness, punch angle and pressure as parameter. The results show the deflection angle as the main indicator related to the defect. The highest SG occurs at thickness 1 mm with a punch angle/pressure of 60°/6×103 kg, causing the highest deflection angle of 4.45°. Oppositely, SB is observed with a maximum deflection of −2.2° when employing punch angle/pressure at 120°/9×103 kg for material with thickness 1.2 mm. One unique result is observed for the processing material at punch angle of 90°. The phenomenon of SB and SG are observed for different parameter. For example, thickness 1 mm experiences SB when using punch pressure 3×103 kg and 9×103 kg, while SG is observed under working pressure 6×103 kg. The microstructure observation shows a change in profile for the material after bending process, which is related to the mechanical deformation and when the deflection value approaches 0°, the microstructure shape profile becomes clearer which is related to plastic deformation. These results provide a reference for suitable dies stamping processing, potentially minimizing the defects and reduces the additional process that involve to repair the defect part. Thus, production quality is maintained optimally through the selection of ideal dies stamping parameters
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