Research of thermomechanical effects at grinding materials and alloys apt to crack rise
DOI:
https://doi.org/10.15587/1729-4061.2015.39422Keywords:
crack-forming, surface layer quality, grinding, nonuniformity, heat flow, simulationAbstract
All available information on diamond abrasive machining thermal processes simulation has been obtained with the suggestion that the materials to be ground are of uniformed structure, and doesn’t take into account presence of the articles’ technology strain defects. Study of causes of forming cracks as grinding defects was made within the theory of strain-stressed state of a part’s surface layer qualitatively or experimentally in every single case. This article contains analysis of crack forming causes when grinding materials and alloys apt to this kind of defects. It’s shown that crack-forming intensity is determined by presence of various material heterogeneities to take place at the surface layer during the detail making. Functional dependences are obtained as for technology parameters with crack-forming conditions taken into account, for the process of grinding materials apt to this kind defects to happen. When choosing machining conditions and tool capabilities, one is to take into account heat flow limits to produce when grinding to prevent forming strain defects into cracks.
With the functional dependences between physical-mechanical properties of materials machined and general technology parameters determined, technology criteria were worked out to control a process of defect-free grinding.
References
- Jakimov, A. V., Slobodynik, P. T., Usov, A. V. (1991). The physics of machining. Кiwv, Odessa, Libid, 240.
- Resnikov, A. N. (1981). Physics of thermal processes of tooling of materials. Moscow: "Maschinostroenie", 279.
- Sipaylov, V. A. (1978). Thermal processes at polishing and management by quality of surface. Moscow: "Maschinostroenie", 167.
- Jasherichin, P. I., Rigov, E. V., Averchenkov, V. I. (1977). Technological heredity is in the structure of machines. Mn. "Scitech", 256.
- Jacobus, K., Devor, R. E., Kapoor, S. G. (2000). Machining-Induced residual stress: Experimentation and modeling. Transaction of the ASME: Jornal of manufacturing science and engineering, 122 (1), 20-31. doi: 10.1115/1.538906
- Usov, A. V., Grigorjn, G. D. (1982). Origin of cracks at diamond-abrasive treatment of metals. J "Adamantine materials", 6, 43–55.
- Usov, A. V., Kormilicina, E. A., Salkovskiy, F. M. (1982). Reasons of appearance of defects at polishing of magnetic carboloies. J.Technology of electrical engineering production, 4, 1–3.
- Usov, A. V., Jakimov, A. V., Grigorjn, G. D. (1980). Analysis of terms of origin of polishing cracks and way of their removal. J. Announcer of engineer, II, 27–31.
- Evseev, D. G., Salnikov, A. N. (1978). Physical bases of polishing process. Saratov: yzd. Saratovskogo unyversyteta, 128.
- Chudobin, L. V., Budarin, A. I., Salkovskiy, F. M. (1979). Technology of treatment of high-efficiency magnetic alloys.Publishing house Saratov Universitet, 128.
- Popov, G. J. (1982). The elastic stress concentration near stamps, cuts, thin inclusions and reinforcements. Мoscow: Nauka, 344.
- Podsey, A. V., Jakimov, A. V. (1974). Polishing defects and ways of their removal. J. "Maschinostroenie", 41–43.
- Korchak, S. N. (1974). Productivity of process of polishing of steel details. Moscow: "Maschinostroenie", 260.
- Burnakov, K. K., Mostaligin, G. P. (1975). Reasons of formation of cracks at polishing. J."Announcer of engineer", 9, 60–61.
- Usov, A. V., Jakimov, A. V., Sazonov, I. P. (1981). Influence of thermal and mechanical tensions on formation of cracks at polishing of the cemented alloys. Theses of lecture the "Modern problems of cutting by instruments from over hard materials", Kharkiv, 57–61.
- Usov, A. (1991). Improving the efficiency of the process defect-free grinding of materials and alloys that are prone to crack formation. Кiev, 324.
Downloads
Published
How to Cite
Issue
Section
License
Copyright (c) 2015 Анатолий Васильевич Усов, Лариса Александровна Воробйова, Сергей Григорьевич Смирный
This work is licensed under a Creative Commons Attribution 4.0 International License.
The consolidation and conditions for the transfer of copyright (identification of authorship) is carried out in the License Agreement. In particular, the authors reserve the right to the authorship of their manuscript and transfer the first publication of this work to the journal under the terms of the Creative Commons CC BY license. At the same time, they have the right to conclude on their own additional agreements concerning the non-exclusive distribution of the work in the form in which it was published by this journal, but provided that the link to the first publication of the article in this journal is preserved.
A license agreement is a document in which the author warrants that he/she owns all copyright for the work (manuscript, article, etc.).
The authors, signing the License Agreement with TECHNOLOGY CENTER PC, have all rights to the further use of their work, provided that they link to our edition in which the work was published.
According to the terms of the License Agreement, the Publisher TECHNOLOGY CENTER PC does not take away your copyrights and receives permission from the authors to use and dissemination of the publication through the world's scientific resources (own electronic resources, scientometric databases, repositories, libraries, etc.).
In the absence of a signed License Agreement or in the absence of this agreement of identifiers allowing to identify the identity of the author, the editors have no right to work with the manuscript.
It is important to remember that there is another type of agreement between authors and publishers – when copyright is transferred from the authors to the publisher. In this case, the authors lose ownership of their work and may not use it in any way.
