Selection of parameters combination of thermoelectric materials for development of high-reliability coolers
DOI:
https://doi.org/10.15587/1729-4061.2015.42474Keywords:
reliability, thermoelectric coolers, stages, materials, efficiency, temperatureAbstract
The possibilities of constructing two-stage high-reliability thermoelectric devices using the same combinations of parameters of raw materials in stages with equal efficiency at the series electrical connection of the stages were considered. The calculation data of the basic reliability parameters and indicators of the two-stage thermoelectric device using different combinations of parameters in stages for temperature changes from 60K to 90K and operation modes: maximum cooling capacity, maximum cooling capacity at a given current, maximum coefficient of performance, minimum failure rate were given.
It was proved that the approach to the thermocouple material selection by average efficiency, electrical conductivity and thermal conductivity indicators, adopted in the industrial production of thermoelectric modules is not optimized in terms of reliability of thermoelectric modules.
As a result of the analysis of reliability indicators of thermoelectric cooler for different combinations of parameters of raw materials, the possibility of increasing the probability of failure-free operation by more than 10% for all operation modes was revealed.
It was shown that an increase in thermoelectric cooling capacity in stages increases the cooling capacity or decreases the number of thermocouples, which together with the use of raw materials with high electrical conductivity allows to reduce the total failure rate and increase the probability of failure-free operation of two-stage devices.
References
- Thermoelectric modules market. Analytical review (2009). Moscow: RosBussinessConsalting, 92. Available at: http://marketing.rbc.ru
- DiSalvo, F. J. (1999). Thermoelectric Cooling and Power Generation. Science, 285 (5428), P. 703–706. doi: 10.1126/science.285.5428.703
- Bell, L. E. (2008). Cooling, Heating, Generating Power, and Recovering Waste Heat with Thermoelectric Systems. Science, 321 (5895), 1457–1461. doi: 10.1126/science.1158899
- Zebarjadi, M. Esfarjani, K., Dresselhaus, M. S., Ren, Z. F., Chen, G. (2012). Perspectives on thermoelectrics: from fundamentals to device applications. Energy & Environmental Science, 5 (1), 5147–5162. doi: 10.1039/c1ee02497c
- Sootsman, J. R., Chung, D. Y., Kanatzidis, M. G. (2009). New and Old Concepts in Thermoelectric Materials. AngewandteChemieInternational Edition, 48 (46), 8616–8639. doi: 10.1002/anie.200900598
- Shevelev, A. V. (2010). Nanostructured thermoelectric materials. Moscow: Research and Education Center for Nanotechnology MSU Lomonosova, 58.
- Kozhemyakin, G. N., Turpentine, S. J., Kroot, Y. M., Parashchenko, A. N., Ivanov, O. N., Soklakova, O. N. (2014). Nanostructured bismuth and antimony tellurides for thermoelectric heat pump. Thermoelectricity, 1, 37–47.
- Brown, S. R., Kauzlarich, S. M., Gascoin, F., Snyder, G. J. (2006). Yb 14 MnSb11: New High Efficiency Thermoelectric Material for Power Generation. Chemistry of Materials, 18 (7), 1873–1877. doi: 10.1021/ cm060261t
- Wereszczak, A. A., Wang, H. (2011). Thermoelectric Mechanical Reliability. Vehicle Technologies Annual Merit Reviewand Peer Evaluation Meeting. Arlington, 18.
- Iversen, B. B., Palmqvist, A. E. C., Cox, D. E., Nolas, G. S., Stucky, G. D., Blake, N. P., Metiu, H. (2000). Why are Clathrates Good Candidates for Thermoelectric Materials? Journal of Solid State Chemistry, 149 (2), 455–458. doi: 10.1006/jssc.1999.8534
- Nesterov, S. B., Holopkin, A. I. (2014). Assessing the possibility of increasing the thermoelectric figure of merit of nanostructured semiconductor materials for cooling technology. Cooling technology, 5, 40–43.
- Singh, R. (2008). Experimental Characterization of Thin Film Thermoelectric Materials and Film Deposition VIA Molecular Beam Epitaxy. University of California, 54.
- Gromov, G. (2014). Volumetric or thin-film thermoelectric modules. Components and technologies, 9, 38–43.
- Riffat, S. R., Xiaoli, M. (2004). Improving the coefficient of performance of thermoelectric cooling systems. Internation journal of energy research, 28 (9), P. 78 – 85. doi: 10.1002/er.991
- Jurgensmeyer, A. L. (2011). High Efficiency Thermoelectric Devices Fabricated Using Quantum Well Confinement Techniques. ColoradoStateUniversity, 54.
- Lau, P. S., Neydzh, M. D. (2004). Evaluation of thermoelectric refrigerators reliability. Thermal equipment. Technology, 1, 43–46.
- Zaykov, V. P., Meshcheryakov, V. I., Gnatovskaya, A. A., Zhuravlev, Y. I. (2015). The influence of the thermoelectric efficiency of raw materials on reliability of thermoelectric cooling devices performance. Part 1: Single stage TED. Technology and design of electronic equipment, 1, 44–48.
- Zaykov, V. P., Kinshova, L. A., Efremov, V. I. (2005). Cooling capacity of thermoelectric devices in a wide range of temperatures. Thermal regimes and cooling electronics, 1, 53–59.
- Zaykov, V. P., Meshcheryakov, V. I., Gnatovskaya, A. A. (2011). Effect of heat stress on the reliability of two-stage thermoelectric cooling devices. Eastern-European Journal of Enterprise Technologies, 4/9 (52), 34–38. Available at: http://journals.uran.ua/eejet/article/view/1477/1375
- Zaykov, V. P., Kinshova, L. A., Moiseev, V. F. (2009). Prognostication of reliability performance of thermoelectric cooling devices. Book 1 Single stage device. Odessa: Politehperiodika, 108.
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Copyright (c) 2015 Владимир Петрович Зайков, Владимир Иванович Мещеряков, Юрий Иванович Журавлев
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